Home Assistant Multisensor (Custom PCB + Enclosure)

Home automation systems benefit from reliable, unobtrusive sensor nodes that can be deployed throughout a space. The goal was a compact multisensor device designed for Home Assistant integration with a clean design and a custom electronics stack.

The project centers on a compact sensor node concept with custom electronics and enclosure. Data is surfaced through a Home Assistant dashboard to provide live visualization of environment/state. The emphasis is on end-to-end product thinking: electronics + enclosure + user-facing presentation. Working with a team of two other undergraduate students made this possible.

The hardware includes a custom PCB and a 3D-printed enclosure designed around a compact cylindrical form factor. The enclosure design supports a clean external appearance while allowing access to power and internal components.

Firmware/software work focuses on stable sensor readout and publishing data for Home Assistant consumption, enabling dashboard visualization and device status reporting.

The system was demonstrated in a showcase/poster format with physical prototypes and live dashboard visualization. The work demonstrates integration across hardware, enclosure design, and UI/data presentation.

Building a compact device forces discipline in PCB layout, connector choices, and enclosure constraints. A key takeaway is that effective public demos require mechanical, electrical, and UI polish to converge—not just functional firmware.

Finalize sensor set and power strategy, improve manufacturability of the enclosure, and harden the integration pipeline for long-term deployment (reliability, updates, diagnostics).